System for reducing apparent height of a board system

ABSTRACT

A system for reducing an apparent height of a board system is provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.

RELATED APPLICATIONS AND PRIORITY CLAIM

[0001] This application claims priority to and is a continuationapplication of co-pending U.S. patent application Ser. No. 09/943,954filed Aug. 31, 2001 incorporated herein by reference.

FIELD OF THE INVENTION

[0002] The present invention generally relates to a system for reducingapparent height of a board system.

BACKGROUND OF THE INVENTION

[0003] Space is always at a premium in an electronic housing. Forexample, as the technology in the wireless communications industryimproves, the wireless communications devices and, in particular, thehousings of the wireless communications devices are becoming moreminiaturized. The shrinking dimensions of the housing are in starkcontrast to the increasing dimensions and, in particular, the increasingheight of some components on the main board of the wirelesscommunications device that are becoming more powerful and are beingasked to perform multiple complex tasks.

[0004] Conventional solutions may include, for example, using largerhousing dimensions or using less powerful components which have smallerdimensions. Such conventional solutions are often inconvenient andundesirable to consumers. Alternatively, the cost of the wirelesscommunications devices can be increased dramatically by researching,developing and marketing a powerful component that has smallerdimensions. However, in a competitive arena such as the wirelesscommunications industry, consumers may be reluctant to absorb suchadditional costs.

[0005] In another example, computer industry standards relating to thedimensions of a printed circuit board (e.g., motherboards, expansionboards) have already been set. Accordingly, as computer tasks becomemore intricate, the hardware mounted on the printed circuit boards alsobecomes more complex. As components mounted on the printed circuit boardbecome more powerful, the size and, in particular, the height of thecomponents becomes greater. In some cases, the apparent height of thecomponent may exceed the standard dimensions. Thus, the printed circuitboard with component mounted thereon may not fit in the standard boardslot or electronic housing.

[0006] The conventional solutions have proven to be unsatisfactory. Forexample, by using less powerful components with, for example, shorterdimensions, the printed circuit board can fit in the standard electronichousing or board slot. However, such a technique fails to take advantageof available and more powerful components. Alternatively, conventionalmethods may include designing custom electronic housings or custom boardslots. Such conventional methods have a disadvantage of being costly andincompatible with industry adopted standards and with components and/orparts that adhere to the industry adopted standards. In still anotheralternative, the cost and time to market of the computer or server canbe increased dramatically by researching, developing and marketing apowerful component that has smaller dimensions. The computer industry isanother competitive arena in which costs are reluctantly absorbed byconsumers and in which the technology is changing so rapidly that thecosts in time and the risks of obsolescence can be quite significant.

SUMMARY OF THE INVENTION

[0007] The present invention provides a system for reducing apparentheight of a board system and alleviates to a great extent thedisadvantages of conventional systems.

[0008] In an exemplary embodiment, the present invention may include,for example, a carrier, a component, a printed circuit board and/or asolder material. The component is mounted on a first side of thecarrier. The printed circuit board has a hole that is structured toaccommodate the component. The solder material solders the carrier tothe printed circuit board and provides a structural bond between thecarrier and the printed circuit board. At least one portion of thesolder material provides an electrical coupling between the carrier andthe printed circuit board and at least one portion of the component ismaintained in the hole after the carrier is soldered to the printedcircuit board.

[0009] The present invention has an advantage of reducing an apparentheight of the component on a printed circuit board and/or reducing atotal height of a board system. Thus, for example, components, thattypically could not be mounted on a printed circuit board due toparticular space limitations within a housing, can be added to theprinted circuit board without exceeding the particular spacelimitations.

[0010] These and other features and advantages of the present inventionwill be appreciated from review of the following detailed description ofthe present invention, along with the accompanying figures in which likereference numerals refer to like parts throughout.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011]FIG. 1 shows a side view illustrating an exemplary embodiment of aboard system according to the present invention;

[0012]FIG. 2 shows a perspective view illustrating an exemplaryembodiment of a carrier system according to the present invention;

[0013]FIG. 3 shows a top view illustrating an exemplary embodiment ofthe board system according to the present invention;

[0014]FIG. 4A shows a side view illustrating a conventional boardsystem;

[0015]FIG. 4B shows a side view illustrating an exemplary embodiment ofthe board system according to the present invention;

[0016]FIG. 5 shows a side view illustrating an exemplary embodiment ofthe board system according to the present invention; and

[0017]FIG. 6 shows a side view illustrating an exemplary embodiment ofthe board system according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0018]FIG. 1 shows an exemplary embodiment of a system for reducingapparent height of a board system 100 according to the presentinvention. The board system 100 may include, for example, a printedcircuit board (PCB) 110, a carrier system 120 and/or a solder material130. The carrier system 120 may include, for example, a carrier 140, acomponent 150 and/or a paste material 160. The component 150 is coupledto the carrier 140 via the paste material 160 or via conventionalcoupling means known to one of ordinary skill in the art. The pastematerial 160 may provide an electrical connection between the component140 and the carrier 140. The PCB 110 may include, for example, a holethat is structured to accommodate the component 150. When the carriersystem 120 is coupled to the PCB 110 via the solder material 130, thecomponent 150 may be, at least partly, disposed in the hole 115 of thePCB 110. The solder material 130 may provide a structural bond betweenthe carrier system 120 and the PCB 110. In addition, at least a portionof the solder material 130 may provide an electrical coupling betweenthe carrier system 120 and the PCB 110 and, in particular, between thecarrier 140 and the PCB 110. Accordingly, an electrical path is formedbetween the component 150 and the PCB 110 via the paste material 160,the carrier 140 and the solder material 130. This electrical path may bethe sole electrical path between the component 150 and the PCB 110.

[0019] In an exemplary embodiment, the system 100 may be part of alarger system such as, for example, a computer system, a wirelesscommunications system or any other system that employs printed circuitboards. Thus, for example, a wireless communications device may include,for example, an antenna that is coupled to the component 150 such as,for example, a duplexer 170, via the PCB 110. As illustrated in FIG. 2,the duplexer 170 may include a plurality of ports of which only two 180,190 are shown. Although shown on side walls of the duplexer 170, theports may be disposed any of the walls of the duplexer 170 and mayextend across combinations of walls. In the duplexer 170, one of theports 180 may be reserved, for example, as an input or an output for theantenna the wireless communications device. Another port 190 may bededicated, for example, as an output port for a reception branch of thecommunications circuitry mounted or printed on the PCB 110. In yetanother port, the duplexer 170 may be dedicated, for example, as anoutput port for a transmission branch of the communications circuitry,for example, mounted or printed on the PCB 110. Other ports may also beprovided such as, for example, an electrical ground port, which are wellknown to one of ordinary skill in the art, but are not described furtherherein.

[0020] As shown in FIG. 2, the paste material may be spread across thebase of the duplexer 170. The paste material 160 may be spread acrossthe entire base of the duplexer 170 or in portions of the base of theduplexer 170. For example, if a port is located on the base of theduplexer 170 or if the port 180, 190 extends from the side wall of theduplexer 170 to a portion of the base, then the paste material 160 maybe spread in the region of that portion of the base. If applicable, thepaste material 160 may be exposed to raised temperatures which aid inmelting the paste material 160. As the paste material 160 cools, it can,for example, harden into a structural bond. The paste material 160 mayalso provide an electrical connection between the duplexer 170 and thecarrier 140. For example, the carrier 140 may include electrical traces200 and pads 210. The electrical traces 200 may extend beneath theduplexer 170. The paste material 160 may provide the electricalconnection between the ports 180, 190 of the duplexer 170 and theelectrical traces 200 and pads 210 of the carrier 140.

[0021]FIG. 3 illustrates a top view of another exemplary embodiment ofthe board system 100 according to the present invention. The duplexer170 is illustrated as having two ports 180, 190 (although the duplexer170 may have additional ports not shown). The ports 180, 190 aredisposed on the base of the duplexer 170, but may also extend to, forexample, a side wall of the duplexer 170 or may entirely be disposed ona side wall of the duplexer 170. The paste material 160 is spread acrossportions of the base of the duplexer 170 that are in the region of theports 180, 190. The duplexer 170 is mounted on the carrier 140 such thatthe ports 180, 190 come in contact with or are coupled to the traces 200of the carrier 140. The paste material 160, which may be heated to atleast its melting temperature and then cooled, may provide a structuralbond between the duplexer 170 and the carrier 140. In addition, thepaste material 160 may also provide an electrical connection between theports 180, 190 and the traces 200. For example, the paste material 160may include solder material.

[0022] The PCB 110 includes the hole 115 through which the duplexer 170at least partly extends as illustrated in FIG. 3. The PCB 110 is alsoshown with electrical pads 220 disposed on a bottom side of the PCB 110.Although not shown, the electrical pads 220 are coupled to othercircuitry and/or components disposed on the PCB 110. A portion of thesolder material 130 is diposed on at least a portion of the electricalpads 210 of the carrier 140. The solder material 130 may be in the form,for example, of a ball, bump and/or mass. The carrier system 120 isbrought up towards the PCB 110 such that the solder material 130 is incontact with the electrical pad of the PCB 110. The solder material 130is heated to at least its melting temperature before being cooled. Thesolder material 130 may, for example, have a lower melting temperaturethan the paste material 160. Thus, the solder material 130 may be heatedto a temperature that is at least above the melting temperature of thesolder material 130, but that is below the melting temperature of thepaste material 160.

[0023] Thus, the solder material 130 may provide a structural bond aswell as an electrical connection between the electrical pads of thecarrier 140 and the electrical pads of the PCB 110. In fact, the soldermaterial 130 may provide the only structural bond between the carrier140 and the PCB 110. The solder material 130 may provide the onlyelectrical connection between the carrier 140 and the PCB 110. Thus, thesolder material 130 may provide the only electrical connection betweenthe duplexer 170 and the PCB 110.

[0024]FIG. 4a shows a conventional board system with the duplexer 170mounted on the PCB 110. Illustrated heights include a duplexer height hdand a PCB height h_(pc). Accordingly, a total height ht of the boardsystem may be given by the relation:

h _(t) =h _(d) +h _(pc).

[0025] The apparent height h_(a), which extends from the PCB 110 to thetop of the duplexer 170, is given by the relation:

h_(a)=h_(d).

[0026]FIG. 4b shows an exemplary embodiment of the board system 100according to the present invention. Illustrated heights include theduplexer height hd, the PCB height h_(pc), a carrier height h_(c) and asolder material height h_(s). Accordingly, a total height ht of theboard system 100 may be given by the relation:

h _(t) =h _(d) +h _(c).

[0027] In an exemplary embodiment, the carrier height h_(c) of the boardsystem 100 may be less than the PCB height h_(pc), thus the total heighth_(t) of the board system 100 is less than the total height h_(t) of theconventional board system. In addition, the board system 100 has a firstapparent height h_(a1), which extends from the PCB 110 to the top of theduplexer 170, and a second apparent height h_(a2), which extends fromthe bottom of the PCB 110 to the bottom of the carrier 140, that may begiven by the relations:

h _(a1) =h _(d) −h _(pc) −h _(s), and

h _(a2) =h _(s) +h _(c).

[0028] The first apparent height h_(a1) is definitely less than theapparent height of the conventional board system. Furthermore, thesecond apparent height h_(a2) is typically less than the apparent heightof the conventional board system since the solder material height h_(s)and the printed circuit board height h_(pc) are usually much smallerthan duplexer height h_(d).

[0029]FIG. 5 illustrates another exemplary embodiment of the boardsystem 100 according to the present invention. The duplexer 170 has beenmodified to include a first portion 230 and a second portion 240. Thesecond portion 240 includes a protrusion 250 that may extend laterallybeyond the lateral reach of the first portion 230. Duplex ports 180, 190may be disposed on, for example, at least the top of the protrusion 250.Accordingly, the solder material 130 can couple structurally and/orelectrically the duplex ports 180, 190 to the electrical pads of the 220of the PCB 110. The modified structure of the duplexer 170 reduces theneed for using the carrier 140.

[0030]FIG. 6 illustrates another exemplary embodiment of the boardsystem 100 according to the present invention. The board system 100includes the PCB 110 which includes a recess 260. The recess 260 may beformed via molding, cutting, shaving or any other method known to one ofordinary skill in the art. The duplexer 170 is mounted on the PCB 110 inthe recess 260. The electrical coupling of the duplexer 170 to the PCB110 may be achieved using, for example, conventional methods known toone of ordinary skill in the art.

[0031] Thus, it is seen that systems for reducing apparent height of aboard with a component are provided. One skilled in the art willappreciate that the present invention can be practiced by other than thepreferred embodiments which are presented in this description forpurposes of illustration and not of limitation, and the presentinvention is limited only by the claims that follow. It is noted thatequivalents for the particular embodiments discussed in this descriptionmay practice the present invention as well.

What is claimed is:
 1. A system for reducing apparent height of a boardsystem, comprising: a carrier; a component mounted on a first side ofthe carrier; a printed circuit board with a hole, the hole beingstructured to accommodate the component; and a solder material solderingthe carrier to the printed circuit board and providing a structural bondbetween the carrier and the printed circuit board, at least one portionof the solder material providing an electrical coupling between thecarrier and the printed circuit board, wherein at least one portion ofthe component is maintained in the hole after the carrier is soldered tothe printed circuit board.
 2. The system according to claim 1, furthercomprising a paste material disposed between the component and the firstside of the carrier.
 3. The system according to claim 2, wherein thepaste material is adapted to provide a bond between the component andthe carrier and is adapted to provide an electrical coupling between thecomponent and the carrier.
 4. The system according to claim 3, whereinthe carrier includes a printed circuit printed on at least the firstside of the carrier, and wherein the paste material is adapted toprovide an electrical coupling between the printed circuit of thecarrier and the component.
 5. The system according to claim 4, whereinthe component is electrically coupled to the printed circuit board viathe paste material, the printed circuit of the carrier and the soldermaterial.
 6. The system according to claim 3, wherein the paste materialhas a higher melting temperature than the solder material.
 7. The systemaccording to claim 1, wherein the solder material provides the onlyelectrical coupling between the carrier and the printed circuit board.8. The system according to claim 1, wherein the solder material providesthe only structural bond between the carrier and the printed circuitboard.
 9. A wireless communications device, comprising: a duplexer; acarrier board having a first side on which is mounted the duplexer; aprinted circuit board with a hole through which the duplexer fits; and asolder material soldering the carrier board to the printed circuit boardand providing a structural bond between the carrier board and theprinted circuit board, at least one portion of the solder materialproviding an electrical coupling between the carrier board and theprinted circuit board, wherein the duplexer is coupled electrically toprinted circuit board via the carrier board and the at least one portionof the solder material.
 10. A computer system, comprising: a printedcircuit board; a packaged integrated chip; a carrier having a first sideon which the packaged integrated chip is mounted; a printed circuitboard with a hole through which the packaged integrated chip fits; and asolder material soldering the carrier to the printed circuit board andproviding a structural bond between the carrier and the printed circuitboard, at least one portion of the solder material providing anelectrical coupling between the carrier and the printed circuit board,wherein the packaged integrated chip is coupled electrically to printedcircuit board via the carrier board and the at least one portion of thesolder material.
 11. A system for reducing apparent height of a boardsystem, comprising: a printed circuit board with a recess on a firstside of the printed circuit board, the hole being structured toaccommodate the component; and a component mounted on the printedcircuit board in the recess.
 12. A system for reducing apparent heightof a board system, comprising: a component having a first portion and asecond portion, the second portion including a lateral protrusion; aprinted circuit board with a hole, the hole being structured toaccommodate the component; and a solder material soldering the componentto the lateral protrusion and providing a structural bond between thecomponent and the printed circuit board, at least one portion of thesolder material providing an electrical coupling between the componentand the printed circuit board, wherein at least part of the firstportion of the component is maintained in the hole after the componentis soldered to the printed circuit board.